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Engineer/ Senior/ Principal Product Integration Engineer, FE CPIE High Performance Memory (HPM)
Visualizza: 127
Giorno di aggiornamento: 05-11-2024
Località: Taoyuan District Taoyuan City
Categoria: Altra
Industria: Appliances Electrical Electronics Manufacturing Computer Hardware Manufacturing Semiconductor Manufacturing
Tipo di lavoro: Full-time
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Contenuto del lavoro
Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR24882 Engineer/ Senior/ Principal Product Integration Engineer, FE CPIE High Performance Memory (HPM) (Evergreen)As a Central Product Integration Senior Engineer/ Principal Engineer at Micron Technology, Inc., you will be responsible for providing leadership to the global Micron network to drive yield, product quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.This role needs to centralize the project information, including achievements, design requirements and testing difficulties from multiple departments located in Japan, US; and drive the project to meet specs within defined tight schedule.Responsibilities And Tasks- Promote worldwide alignment for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
- Drives yield breakthroughs by understanding the comprehensive test flow across steps, testing conditions and propose an effective solution for yield versus reliability requirements.
- Foster innovation to tackle yield issues with the help of generating ideas from characterizing the device fail-modes using the deeper expertise in device architecture, physics and available testing knobs.
- Lead a multi-functional team to build frontiers in the areas of yield improvement by demonstrating the knowledge of test flow, device, bench char, fab process and technologies.
- Strong collaboration with PE, Fab, TSE, GQ to develop best in class process, BKMs and work towards alignment across fabs, tech-nodes and technologies to achieve benchmark yield performance.
- Maintain and improve knowledge and technical expertise, explore innovation opportunities with critical thinking and detailed approach.
- Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner.
- Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
- Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
- Travel to Micron Fab locations as necessary for face-to-face work.
- Bachelor’s / Masters / PhD in Electrical Engineering, Microelectronics, Physics or related field of study
- Knowledge in Semiconductor Device Physics, DRAM operations, parametric/electrical test, and probe yield.
- Experience in Product, Device, Test Engineering will be added advantage.
- The experience on DRAM HPM will be a plus to this job position.
- Good data analysis, debugging, problem solving, reporting and presentation skills.
- Good multi-tasking, verbal, and written communication skills.
- Strong interpersonal skills and customer/co-worker relationships. Proven teamwork skills with a strong focus on developing good team dynamics.
- Good organizational capabilities and ability to work effectively with minimal direction.
- Intermediate to advanced PC skills including Microsoft Office.
- Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
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Scadenza: 20-12-2024
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