Director of Process Integration (28nm, 12 wafer)

Contenuto del lavoro

We’re looking for an experienced Process Integration Director who’s familiar with 28nm logic technology process integration on 12-inch wafers. This position will be based in Hsin-Chu, Taiwan. Some overseas business travels (25%-30%) may be required.Responsibilities

• 28nm (or beyond) logic technology process integration, characterization, and tape-out related coordination.
• Test key and process monitor key design. Process to meet performance and reliability requirements
• Work closely with module/device/test/CAD/design/reliability teams to meet the company’s targets and goals.
• Characterization of logic core/IO devices, layout dependence effect, derivative and SRAM devices
• Design rule and LOP documentation; command files with CAD team
• Develop the Process Integration team.

Requirements

• 10+ years of experience in Process Integration within a wafer foundry (12-inch) environment with minimum 3 years in 28nm technology.
• Multiple team experience across Integration, Device, Module, Design Support.
• Experience with 2-3 of the following areas: FEOL (Front end of line), MEOL (Mid end of line), BEOL (Back end of line), Defect (YE), & Specialty.
• Preferably 3~10 years as a people manager.
• Master/Ph.D. degrees in the fields of Electronics/Electrical/Chemical/Physics/Material.
• Good command of English
• Strong mobility. Able to conduct overseas travels 30%-40% of the time for technology transfers.

Qualified and interested Parties please apply with your CV in Word format to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.