IC Carrier RD (Glass Interposer Package, GIP)

Vue: 194

Jour de mise à jour: 05-11-2024

Localisation: Guishan District Taoyuan City

Catégorie: Science La main doeuvre Haute technologie Mécanique / Technique Electrique / Electronique

Industrie: IT Services IT Consulting Software Development Financial Services Staffing Recruiting

Niveau: Entry level

Type d’emploi: Full-time

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le contenu du travail

Taiwanese-based global tier 1 IC Carrier & PCB manufacturer.

Responsibilities

Glass interposer technology study and development for advanced packaging and 5G application.
New materials and supplier evaluation and implementation.
Collaborate with global tier 1 IC Design House/Wafer Foundry for next generation IC carrier development.
Project delivery from NPI to Mass Production.
Spring TW* This job is agented by Spring Professional Taiwan, the Adecco Group company.

Experience

Education

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