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Silicon Package Development Engineer
Ver: 166
Día de actualización: 05-11-2024
Ubicación: Taipei City
Categoría: Alta tecnología Mecánica / Técnica Eléctrica / Electrónica IT - Software
Industria: Internet
Tipo de empleo: Full-time
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Contenido de trabajo
Facebook’s mission is to give people the power to build community and bring the world closer together. Through our family of apps and services, we’re building a different kind of company that connects billions of people around the world, gives them ways to share what matters most to them, and helps bring people closer together. Whether we’re creating new products or helping a small business expand its reach, people at Facebook are builders at heart. Our global teams are constantly iterating, solving problems, and working together to empower people around the world to build community and connect in meaningful ways. Together, we can help people build stronger communities - we’re just getting started.At Facebook Reality Labs (FRL) our goal is to explore, innovate and design novel interfaces and hardware subsystems for the next generation of virtual, augmented and mixed reality experiences. You will work with a diverse and highly interdisciplinary team of researchers and engineers on the end—to-end development cycle including concept, design, development and integration of those components or system. You will also work cross functionally to develop specifications and test methods, perform performance evaluation and work closely with manufacturing partners for prototyping and mass production.We are looking for skilled and motivated engineers to join our FAST (Facebook Agile Silicon Team) team in FRL, in particular, in the Si Packaging area. Based on your expertise, you will help the teams in the development of Si Packaging solutions that differentiate our products in terms of form factor, performance and cost.
Responsibilities
- Develop and qualify packaging for FB (Facebook) custom Si with configurations ranging from single-chip, module, SiP and processor-memory integration as well as downstream board and system level assembly
- Develop reliability requirements and test plans at component and system levels targeted toward AR/VR products and use cases
- Work closely / on-site with FB’s Packaging partners/OSAT’s to implement development and manufacturing bring-up.
- Bachelor’s degree in Engineering
- 5-10 years of experience in advanced Si package and SiP module development and manufacturing
- Experience and track record to take products from concept to production including development of manufacturing specifications, vendor qualifications and improvement of manufacturing efficiencies and costs.
- Familiarity with risk assessment/ mitigation methodologies like FMEA and DFM
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Plazo: 20-12-2024
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