Principal Package Engineer (11-631)

Contenido de trabajo

Worldwide leading IDM with Analog Solution

Responsibilities

Responsibilities

• As a member of the Advanced Packaging team, the position will manage various aspects of image senor, Lidar and Radar sensor packaging technology development, process improvement, and new product introduction including CSP, BGA and MCP related packages for sensing systems utilized in automotive, consumer, industrial, medical, and mobile applications. Directly support and contribute to the corporate product and technology road-maps.
  

Industry: Semiconductor

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• SpringTW*This job is agented by Spring Professional Taiwan, The Adecco Group company.
  

Experience

Requirement:

• Master’s degree or above of Mechanical Engineering, Chemical Engineering, or Materials Science.
• Minimum of 10 years experience in semiconductor assembly packaging development, process engineering, materials development, and new product introduction.
• Experience with image packaging and related sensor packaging preferred.
• Experience with wafer level CSP, TSV, and multi-chip packaging very desirable.
• Possess a solid understanding of packaging materials and properties.
• Experience with thermal and mechanical stress very desirable.
• Familiarity with AutoCAD and 3D modeling a plus.
• Proven experience utilizing statistical analysis techniques such as DOE.
• Understanding of package reliability requirements for consumer, industrial, medical, and automotive applications.
• Strong project management and problem solving skills needed.
• Bilingual in English and Mandarin Chinese.
  

Education

Bachelor’s Degree in a technical field with minimum 6 years of working experience in relevant industry