Tipo de empleo: Full-time

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Contenido de trabajo

【工作內容】(3699)

IGBT Power Module(功率模組)之新產品報價、構裝製程設計、製程開發、新產品導入、構裝技術專利開發

【必要條件】(擇一即可)
  • 具備IGBT電源模組組裝(IGBT Power Module Assembly)經驗或是離散功率零件組裝(Power Discrete Assembly)經驗
  • 具備打線Wire bond(Ball bond: 金線、銅線, Wedge bond: 粗鋁線、粗銅線)經驗
  • 具備著晶Die bond(膠結合、合金結合及Sintering)經驗
  • 具備封裝Encapsulation(EMC Molding, Epoxy Potting, Silicone Potting)等經驗

【加分條件】

具備SMT 製程經驗者佳

【職缺投遞】https://usiglobal.freshteam.com/jobs

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Plazo: 20-12-2024

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