Packaging Development Engineer (Power Module)
Ver: 161
Día de actualización: 05-11-2024
Ubicación: Zhongshan District Taipei City
Categoría: Alta tecnología Mecánica / Técnica Eléctrica / Electrónica
Industria: Semiconductor Manufacturing Industrial Machinery Manufacturing
Posición: Mid-Senior level
Tipo de empleo: Full-time
Contenido de trabajo
Job Description
- Packaging Development Engineer for power electronic products
- Package design and process development in co-operation with supplier and product engineering team.
- Developing solutions for assembly processes for automotive application.
- Coordination of sample manufacturing at assembly partner.
- Team work in English language with a multitude of international interfaces is mandatory.
Qualifications
- 3-8 years experiences in packaging/assembly of semiconductors including power semiconductors preferred
- Solid technical background in assembly technology
- Passion for developing technical solutions in multidisciplinary international projects
- Very good English skills and experience in international cooperation
- Ability to travel
Please apply via below link:
https://smrtr.io/bf2ZJ
Plazo: 20-12-2024
Haga clic para postularse como candidato gratuito
Reporte trabajo
TRABAJOS SIMILARES
-
⏰ 05-12-2024🌏 Xinyi District, Taipei City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 New Taipei City
-
⏰ 05-12-2024🌏 Banqiao District, New Taipei City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Banqiao District, New Taipei City
-
⏰ 05-12-2024🌏 Nangang District, Taipei City
-
⏰ 05-12-2024🌏 Kaohsiung City