Packaging Development Engineer (MEMS products)
Ver: 101
Día de actualización: 05-11-2024
Ubicación: Zhongshan District Taipei City
Categoría: Alta tecnología Mecánica / Técnica Eléctrica / Electrónica
Industria: Industrial Machinery Manufacturing Semiconductor Manufacturing
Posición: Mid-Senior level
Tipo de empleo: Full-time
Contenido de trabajo
Job Description
- Packaging Development Engineer for MEMS products
- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.
- Developing solutions for assembly processes of MEMS for automotive and consumer application.
- Coordination of sample manufacturing at assembly partner.
- Team work in English language with a multitude of international interfaces is mandatory.
Qualifications
- 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, and WLCSP packages.
- Preferred Solid technical background in assembly technology
- Passion for developing technical solutions in multidisciplinary international projects
- Experience in international corporation
- Ability to travel
- Very good English skills
- Good team work with multitude of international interfaces
Please apply via below link:
https://smrtr.io/b9kM4
Plazo: 20-12-2024
Haga clic para postularse como candidato gratuito
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