Posición: Entry level

Tipo de empleo: Full-time

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Contenido de trabajo

Your JobMolex is seeking a Thermal Design Engineer to join a team within our Copper Solutions Business Unit that designs, analyzes, and verifies the thermal performance of thermal solution including air-cooling nodule and liquid cooling module for high-speed connectors, cables, and other interconnect systems. All products are design for the data center, telecom, server and storage markets. This engineer will primarily work with mechanical and product manager to develop next generation 112Gbps and 224Gbps interconnects for a wide range of local and international customers.Our Team
  • Lead the design and optimization of high-speed interconnect products using the latest Siemens Flotherm simulation software and analysis methods at both nominal and worst-case boundary conditions.
  • Perform empirical and analytical thermal evaluations of interconnect products to verify designs. Optimized the thermal solution and provide thermal design guide to product design team.
  • Perform simulation to measurement correlation studies.
  • Perform wind tunnel thermal validation and familiar the root cause analysis process.
  • Generate thermal assessment reports, qualification test reports, and other technical reports and presentations for both internal and worldwide customer use.
  • Provide expert thermal advice to product management, sales, FAEs and customers regarding our cage thermal solution products, tranceiver design and applications.
  • Discover and invent new techniques, materials and methods in thermal design, analysis, and verification. Recommend design changes and technical process and procedure improvements.
  • Present research on new and emerging areas of transceiver and thermal solution design, analysis, verification, and industry trends at industry events and conferences.
Who You Are (Basic Qualifications)
    • Bachelor’s degree in Mechanical Engineering, or equivalent experience.
    • 6+ years’ thermal design and verification experience.
    • Master’s degree or PhD in Mechanical Engineering, Thermal.
  • Skills and Abilities:
    • In-depth theoretical understanding of thermal design both on components and systems.
    • Experience using Siemens Flotherm software to design and optimize electronic products.
    • Experience using Wind Tunnel to verify products thermal performance and data logger equipment to record data, the liquid cooling validation equipment experience is preferred.

What Will Put You Ahead
  • Experience designing and verifying transceiver, high-speed interconnects products, server, or networking systems.
  • Able to use Siemens NX or Ansys software to review 3D drawing.
  • Heat sink, Heat pipe, vapor chamber, phase change material design experience.
  • Liquid cooling cold plate design, simulation, and verification experience.
  • Excellent interpersonal, bi-lingual communication, and organizational skills.
  • Ability to prioritize, problem solve, as well as develop and meet project schedules.
  • Team player who can lead and work independently when needed.
  • Standards committee participation & Technical papers published.
At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate’s knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.Who We Are{Insert company language from Company Boilerplate Language Guide}At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.
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Plazo: 20-12-2024

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