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CAD/PCB Design Engineer, Pixel
Ver: 123
Día de actualización: 05-11-2024
Ubicación: Xindian District New Taipei City
Categoría: IT - Software
Industria: Information Services Internet Publishing
Tipo de empleo: Full-time
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Contenido de trabajo
Google welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Taoyuan, Taoyuan District, Taoyuan City, Taiwan; Xindian District, New Taipei City, Taiwan.
Minimum qualifications:
- Bachelor’s degree in Electronics or equivalent practical experience
- 3 years of Computer-aided Design (CAD) or Printed Circuit Board (PCB) design experience
- 3 years of working experience with PCB Design tools
- Experience with DFM Tools (Valor, CAM350), Allegro Skill scripting, or Simulation tools
- Proficient with high-speed and RF board designs or layouts; familiar with high density ball-grid array (BGA), HDI, and Anylayer layout design
- Familiarity with all phases of hardware development including schematic entry, manually generated constraints, requirements of the constraints, and board layout
Google’s custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you’re sure it meets Google’s standards of quality and reliability.
The Google Pixel team focuses on designing and delivering the world’s most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.
Responsibilities
- Work with cross functional teams to set up the mechanical outline, stackup, and PCB design rule constraints of the board.
- Execute component placement and routing of rigid boards, Flexible Printed Circuits (FPC), and Rigid flex board; participate in design reviews providing expert recommendations as needed.
- Interface with vendors to select and use correct impedance rules, Design for Manufacturing (DFM), Design for Assembly (DFA) rules.
- Generate manufacturing files and address any internal or external DFM feedback.
- Work with Hardware Engineers, PCB Designers, Mechanical Designers and vendors for development and sustaining of actual products.
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Plazo: 20-12-2024
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