模擬工程師(應力模擬)

Ver: 131

Día de actualización: 05-11-2024

Ubicación: Hsinchu County

Categoría: R & D Alta tecnología Mecánica / Técnica Eléctrica / Electrónica

Industria: Semiconductor Manufacturing

Posición: Associate

Tipo de empleo: Full-time

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Contenido de trabajo

Job Description

Electrical package warpage and component stress simulation and analysis (FBGA, FCBGA, FOWLP, FOPLP, 3D IC CIS CSP, TSOP, QFN, QFP......).

Electrical package thermal simulation and analysis (JESD51 standard).

Electrical package mold flow and wire sweep simulation and analysis.

Board level drop test experiment and analysis (JESD22-B111 standard).

Warpage measurement by shadow moire (JESD22-B112 standard).

Database establishment and utility development.

New simulation capability development.

Requirement

Mechanical engineering master degree.

Thermal stress analysis capability.

Capable to operate ANSYS mechanical and AutoCAD.

Interesting in simulation and experiment.

With electrical package assembly experience is better.

* 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

* 資深人員薪資另議。

* 勞工一般體格檢查：為符合職業安全衛生法規定，報到前請完成體檢，並於報到當日繳交體檢報告，以配合法令保護您的權益。

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