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Staff Package Engineer
Aussicht: 181
Update Tag: 05-11-2024
Ort: Zhubei City Hsinchu County
Kategorie: Design - Web Kunst / Design Architektur / Innenarchitektur IT - Software
Industrie: Semiconductor Manufacturing
Jobtyp: Full-time
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Jobinhalt
About MarvellAt Marvell, we believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. Trusted by the world’s leading technology companies for 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.The data infrastructure that our customers build has never been more critical to our global economy. It’s what’s keeping the world connected, businesses running, and information flowing. If you’re ready to excel, innovate, and truly enjoy your work, apply now for the position detailed below.The OpportunityPackage EngineeringJob Responsibilities- Marvell is a data infrastructure technology company. It moves, stores, processes and secures the world’s data with semiconductor solutions in enterprise, cloud, automotive, and carrier markets.
- As package development lead and work closely with cross functional teams – Sales & Marketing, Si design teams, QA and Product engineering – to develop and provide high performance, cost effective, reliable and manufacturing friendly IC packaging solutions.
- Support both NPIs and 2nd source development
- Work as the expert of manufacturing including both Assembly and substrate fabrication, Perform package substrate layout review using APD.
- Manage and drive OSAT and substrate suppliers on risk assessment, design review/modification and substrate design release.
- Work with QA, OSAT and substrate suppliers to resolve package related quality/reliability issues.
- Apply engineering knowledge of substrate fabrication/assembly to develop new packages or new technologies. Implement DFX. Drive assembly process and yield improvements and prevent quality/reliability issues.
- Min. bachelor’s degree in engineering. EE or ME. Master’s degree preferred.
- Minimum 2 years flip-chip package development and substrate review/design experience using Cadence APD.
- In-depth understanding of the flip-chip substrate design rules and the substrate fabrication processes.
- Project management experience and skills are advantages.
- Good written and verbal communication skills. Collaboration experience with OSAT and substrate suppliers is a plus.
- Good AutoCAD, MS office and computer skills
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Frist: 20-12-2024
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