RFFE Package Manufacturing Engineer

Jobinhalt

Company

Qualcomm Semiconductor Limited

Job Area

Engineering Group, Engineering Group > Manufacturing Engineering

Qualcomm Overview

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary

Member of QCT Engineering & Operation team managing assembly/packaging subcontractor sites in Taiwan.

Examples Of Responsibility Areas

• Production launch into high volume manufacturing (HVM)
• Develop new process manufacturing BKM
• Resolve manufacturing and customer quality issue
• Drive manufacturing yield and process innovation/cost reduction
• New product development
  
  

Examples Of Advanced Package Technologies Supported

• RF/SiP module
• FC CSP / WB CSP
• Bumping /WLP (Optional)
• Other Duties as needed:
• Industry benchmarking and competitive analysis
• Collaborate with internal teams (ie R&D, NPI, quality, test, , Design etc) for many type of issue/projects.
• Interface with external assembly factory, material or equipment vendors to understand latest technologies.
• Project/case management; statistical analysis including DOE methods
  
  

Minimum Qualifications

• Fluent Chinese with functional proficiency in English
• Permitted to work in Taiwan and need to travel within Asia or US on occasion
• Minimum of 10 to 15 years of hands on process experience in assembly and packaging technology.
• Factory or manufacturing career preferred but not must
• Supplier/Subcon management career preferred but not must
• Must be strong written and oral communicator
• BS/MS Engineering / Science
  
  

Working Knowledge Of

• package assembly processes and material
• package reliability testing and failure modes
• industry packaging trends and customer considerations
• Engineering tools (FMEA/DOE/Trouble shooting)
• Quality tools and reports (SPC/PCN/8D/CAR)
• procedure/requirements Qualification and Manufacturing
• JEDEC, IPC and other industry specifications
  
  

Preferred Qualifications

• Ability to travel to Europe, China, Singapore, Philippines and/or Japan also preferred
• Good engineering background with hands on experiences working with suppliers or customers
• Self-motivated project management and good communication skills both in English/Chinese
• Management experience is a plus
  
  

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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