R&D Engineer – System technology modeling

Jobinhalt

-Conduct research in the field of system technology modeling

-Support the logic device and memory device technology research teams and AI hardware research team

- Location: Hsinchu, Taiwan or San Jose, California, USA

Example research topics:

3D Integrated Circuits (3D IC):

1.Developing framework (models and methodology) to evaluate 3D IC performances (including electrical/RC, thermal/self-heating and mechanical strain effects).

2.Design enablement (e.g. PDK) for different 3D IC schemes (e.g. heterogeneous, monolithic, BEOL, etc.)

3.Exploration of novel technology components for 3D integration (e.g. intra-die/chip interconnect, BEOL switches and memories)

Design-technology co-optimization (DTCO) for Emerging Memories:

1.Developing physics-based models for emerging memory technology (e.g. Phase-change, Resistive, Magnetic RAMs)

2.Design enablement (e.g. PDK) for embedded or high-density stand-alone emerging memory arrays.