Manufacturing Development Engineer - Product Development Engineering

Jobinhalt

Job Details:

Job Description:

Join Intel-and engineer the future.

Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So join us-and help us create the next generation of server platforms that will shape the future for decades to come.

The Manufacturing Development Engineer (MDE) is a key member of the Product Development Engineering Team supporting the CPU silicon design and server platform development.

The engineer will provide vital support to develop the manufacturing solution and drive the implementation and execution during the new product introduction (NPI) of next generation server products by direct involvement and through coordination with Intel’s outsource design manufacturers (ODMs), internal and external design teams.

Our server division invents, designs, and builds the world’s most critical computing platforms and in this position the manufacturing engineer will influence the designs to make them manufacturing friendly and invent/influence next generational manufacturing technology.

In this position, you will be responsible for the development and manufacturing of server Printed Circuit Boards (PCBs), Printed Circuit Board Assemblies (PCBAs) and/or system level products. You will also be developing and enhancing processes to improve the consistency and accuracy of the manufacturing engineering toolsets used across all of the world-wide Manufacturing Engineering team. Your responsibilities will include, but not be limited to:

• Lead the development of new scalable manufacturing technology and process to support the business scope expansion for our DCAI/DPEA/DEO business unit.
• Lead factory capability assessments and proactively engage in the new ODM selection decision process.
• Enable ODM factories to meet Intel inversion requirements and drive ODM accountability to manufacture Intel products in a timely manner and with world class quality.
• Document product specific statement of work (SOW) and help make smart request for quote (RFQ) decisions and determine the level of integration appropriate for suppliers, factory, and customers.
• Proactively influence ODM process capability development plans to support Intel DCAI platform/technology roadmap.
• Establish DFM (design for manufacturing) platform requirements and drive DFM rule updates to our database.
• Coordinate the implementation of new component and manufacturing process technologies, tools and fixtures.
• Drive generational mfg learnings into product design and perform development responsibilities to ensure product manufacturability, including but not limited to Process Risk Assessments and FMEA, DFM/A reviews, CAD library symbol reviews, Design/Mfg Spec, TRIAD sheet metal process to enable factory builds.
• Drive to improve the existing operational processes and create new process for the operational excellence.
• Create and/or approve the manufacturing assembly instructions (MAIs) of next generation server assemblies
• Drive resolution of PCB Vendor Design Correction Requests (VDCRs) on next generation platform designs
  

Qualifications:

Qualifications

Candidate must possess a Bachelor of Science degree (with 5+ years of experience) or Master of Science degree (with 2+ years of experience) in Mechanical Engineering, Manufacturing Engineering, Materials Science, Industrial Engineering, Electrical Engineering, Computer engineering or a related engineering field.

Additional qualifications include:

• Strong technical design review capability
• Working knowledge of Design for Manufacturability, throughput analysis, quality control systems, and cost/benefit analysis
• Prior experience acting as a liaison between manufacturing sites and product development teams
• Ability to work well in a diverse team environment
• Experience at coordinating manufacturing operations with outsourced suppliers would be an added advantage
  

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location:

Taiwan, Taipei

Additional Locations:

Business group:

The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world’s most critical computing platforms which fuel Intel’s most important business and solve the world’s most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.