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Firmware Engineer, Modem Power and Thermal
Aussicht: 112
Update Tag: 05-11-2024
Ort: Xindian District New Taipei City
Kategorie: IT - Software Hohe Technologie Mechanische / Technische Elektrik / Elektronik
Industrie: Information Services Technology Information Internet
Jobtyp: Full-time
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Jobinhalt
Google welcomes people with disabilities.Minimum qualifications:
- Bachelor’s degree in Computer Science, Electrical Engineering, Communication, a related technical field, or equivalent practical experience.
- 3 years of experience in power/thermal management in mobile/embedded systems.
- Experience with software development in C/C++.
- Master’s degree or equivalent practical experience.
- Experience with software development/debugging in Android/Embedded Linux or embedded RTOS.
- Knowledge of modem Layer 1 and/or protocol layer software.
- Ability to debug complex embedded software and hardware issues.
In this role, you will influence, drive, and work with diverse cellular modems teams for Pixel phones and other Pixel devices to enhance the power consumption and thermal behavior of the device. You will characterize the power and thermal behavior of the Pixel device and understand any potential issues and improvements and also, develop new software features and frameworks to use the possible power and thermal optimization. This requires a good system understanding, including CPUs and Interconnect, modem and RF technologies, modem protocol stack, power and thermal behaviors on small form-factor devices. You will work with hardware and software engineers from different expertise.
The Google Pixel team focuses on designing and delivering the world’s most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.
Responsibilities
- Work with other cross-functional teams to understand requirements and meet compliance and conformance metrics .
- Optimize and improve modem power consumption, and thermal behavior .
- Investigate and debug power/thermal issues on pre-production or in-market products.
- Build automation for power/thermal measurements/bug triaging, debugging, or analysis.
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Frist: 20-12-2024
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