Jobtyp: Full-time

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Jobinhalt

Job Description
    • Be the Technical Lead and contact window for NPD & site transfer (out-sourcing and in-sourcing) in the external manufacturing organization (Backend)
    • Lead cross functional team (comprising both internal and external stakeholders) for NPD & site transfer projects through product/ process/ manufacturing gap analysis, risk assessment and mitigation to achieve process robustness, 1st pass qualification and flawless production ramp
    • Establish technical excellence, Best Known Methods (BKM) and Best-in-Class practices through collaboration with sending/ receiving site for assembly performance benchmarking, process control, yield improvement and fan-out lesson learnt
    • Prepare and manage assembly sites manufacturing readiness to ensure smooth production release, including safe-launch activities. Support on-site troubleshooting and resolution of process issues
    • Support strategic outsource programs to meet evolving business needs and supply demand.
    • Participate in quality and process readiness audit at receiving sites to achieve manufacturing readiness prior to production release
    • Co-work with operations to drive continuous yield improvement
Job Qualifications
  • Bachelor’s Degree in Engineering/ Materials Science or equivalent technical background
  • More than 8 years of experience in backend semiconductor IC manufacturing environment, with in-depth process expertise and shop floor experience in one or more key processes such as Wafer Processing, Die Attach, Wire-bonding and IC Molding etc
  • Hands on experience in driving assembly device startup/ technology transfer from conceptualization, characterization, qualification to HVM
  • Experience in IC package design/ CAD/ simulation will be highly advantageous
  • Track record of leading cross-functional team, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem solving skills
  • Proficient in statistical analysis methods
  • Strong project management skills and multi-stakeholder management
  • Good overall understanding of outsource assembly & test business landscape and operations
  • Good communication skills and proficient in written & spoken English

Primary Location

TW-TW-Zhubei

Work Locations

TWZC02 ON SEMICONDUCTOR TECHNOLOGY ZHUBEI OFFICE

Job

Engineering

Travel

Yes, 15 % of the Time

Job Posting

May 30, 2021, 6:34:40 PM
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Frist: 20-12-2024

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