BCD Process Integration Manager

☞ TSMC

Aussicht: 139

Update Tag: 05-11-2024

Ort: Tainan City

Kategorie: Produktion / Betrieb Hohe Technologie Mechanische / Technische Elektrik / Elektronik R & D

Industrie: Semiconductor Manufacturing

Position: Mid-Senior level

Jobtyp: Full-time

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Jobinhalt

Responsibilities:

  • Drive leading edge process/device development and optimization of BCD/HV devices in order to meet scaling, performance, reliability, and manufacturability requirements.
  • Support layout production and quality verification for best speed, power and area by using layout techniques.
  • Machine Learning/AI exploratory for layout quality and productivity enhancement.
  • Specialty devices development, characterization and improvement for BCD/HV.
  • Solve device, reliability and yield related issues.
  • Advanced module process development (e.g. EPI, IMP, etc.)

    • Qualifications:

  • Master’s or above degree in EE, Physics, Materials Science, or related fields.
  • 2+ yrs of experience in Specialty Devices or Integration. Experience in semiconductor device development or TCAD simulation is preferred
  • Fluent in English and Mandarin speaking, listening, and writing.
  • Team player with strong communication, collaboration, and project management skills.

    • Thank you for your interest in TSMC. Our recruiting team will carefully review each application. We will contact you within 1 month if we are likely to move forward with you for this position.

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    Frist: 20-12-2024

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