Position: Mid-Senior level

Job type: Full-time

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Position Summary: PDF is seeking an experienced Field Applications Engineer to join the Exensio® team, to serve serves as the primary contact for end-users of the software. Customers include both external and internal (consultant teams). End users of the Exensio® client software are typically Yield, Product, Test, Assembly, Process and Defect Engineers.

Responsibilities:

  • Design, generate and verify specific Characterization Vehicle; test chip layouts to characterize clients’ manufacturing processes and quantify impact of design on product performance and yield. Focus on short flow (BEOL, FEOL) test chips.
  • Use PDF proprietary automated layout tools including layout generators, routers and packers to create, place and route CV test chip structures.
  • Generate all collateral needed for testing, inspection, analysis, and documentation of CV & reg; Test Chips.
  • Participate with client in detailed review of test chip including post-OPC data review and pre mask-making reviews
  • Work closely with PDF CV Analysis Methods to create an optimal design of experiments for CV® test chips.

Qualifications and Skills

· Master’s degree or higher in Engineering or related field

· Sound understanding of semiconductor manufacturing process and transistors.)

· Experience with semiconductor layout methods and layout tool suites (eg, Cadence, Mentor

  • Working knowledge of DRC and LVS tools and deck creation and application
  • Basic knowledge of Unix scripting languages (eg, perl, CSH, SH, Tcl, etc)
  • Hands on experience with parametric test methods
  • Self-motivated and highly professional including some experience with customer interactions
  • Familiarity with interpreting and using Design Rule Manuals for deep sub-mic ron semiconductor processes (both foundry and IDM)
  • Strong semiconductor Yield, Product, Process or Defect Engineering background.
  • Excellent oral and written communications skills
  • Highly professional, self-motivated and self-managed individual

Preferred Skills/Experience

  • Hands on experience using Cadence Virtuoso and/or Cadence SKILL programming language
  • Experience with Mentor Graphics Calibre DRC
  • Responsible for any part of Design for Manufacturability including design modification, verification, algorithms or failure analysis
  • Experience using circuit modeling software (HSPICE, Spectre, etc)
  • Familiar with semiconductor reticle-making practices (mask data prep, dummy fill algorithms, basics of OPC , mask fracturing and biasing, etc)
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Deadline: 20-12-2024

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