CV Design Engineer
View: 281
Update day: 05-11-2024
Location: Zhubei City Hsinchu County
Category: High Technology Mechanical / Technical Electrical / Electronics
Industry: Computer Software Semiconductors
Position: Mid-Senior level
Job type: Full-time
Job content
Position Summary: PDF is seeking an experienced Field Applications Engineer to join the Exensio® team, to serve serves as the primary contact for end-users of the software. Customers include both external and internal (consultant teams). End users of the Exensio® client software are typically Yield, Product, Test, Assembly, Process and Defect Engineers.
Responsibilities:
- Design, generate and verify specific Characterization Vehicle; test chip layouts to characterize clients’ manufacturing processes and quantify impact of design on product performance and yield. Focus on short flow (BEOL, FEOL) test chips.
- Use PDF proprietary automated layout tools including layout generators, routers and packers to create, place and route CV test chip structures.
- Generate all collateral needed for testing, inspection, analysis, and documentation of CV & reg; Test Chips.
- Participate with client in detailed review of test chip including post-OPC data review and pre mask-making reviews
- Work closely with PDF CV Analysis Methods to create an optimal design of experiments for CV® test chips.
Qualifications and Skills
· Master’s degree or higher in Engineering or related field
· Sound understanding of semiconductor manufacturing process and transistors.)
· Experience with semiconductor layout methods and layout tool suites (eg, Cadence, Mentor
- Working knowledge of DRC and LVS tools and deck creation and application
- Basic knowledge of Unix scripting languages (eg, perl, CSH, SH, Tcl, etc)
- Hands on experience with parametric test methods
- Self-motivated and highly professional including some experience with customer interactions
- Familiarity with interpreting and using Design Rule Manuals for deep sub-mic ron semiconductor processes (both foundry and IDM)
- Strong semiconductor Yield, Product, Process or Defect Engineering background.
- Excellent oral and written communications skills
- Highly professional, self-motivated and self-managed individual
Preferred Skills/Experience
- Hands on experience using Cadence Virtuoso and/or Cadence SKILL programming language
- Experience with Mentor Graphics Calibre DRC
- Responsible for any part of Design for Manufacturability including design modification, verification, algorithms or failure analysis
- Experience using circuit modeling software (HSPICE, Spectre, etc)
- Familiar with semiconductor reticle-making practices (mask data prep, dummy fill algorithms, basics of OPC , mask fracturing and biasing, etc)
Deadline: 20-12-2024
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