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Job type: Full-time
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Job content
1. 負責高頻前端系統晶片組的驅動程式開發,使產品可給予其他系統整合使用2. 與其他團隊合作,提供晶片功能執行所需要的軟韌體支援,以執行驗證硬體功能正確性,及達到自動化測試
3. 其他技術文件撰寫
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Deadline: 20-12-2024
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