製程工程師

Job content

说明

What You Will Do In Your Role

Primary Purpose

主要關注重點開發和量產產品所需CNC與壓合技術或電鍍與影像轉移技術 , 整合生技資源, 開發重點開發產品與量產所需技術缺口

Main duty to help Key product and Mass product CNC and tradition hot press processes or copper plating and image transfer technology develop. Working with other PE resource to do process capability gap technology develop.

Duties & Responsibilities

負責NPI 和量產關鍵製程CNC與壓合或電鍍與影像轉移為主與其他製程為輔生產不良改善, 將樣品生產數據進行統計數據分析, 並搭配收集材料特性資料 來依據統計分析結果將技術缺口技術進行問題改善, 達到品質穩定生產需求.

Responsible for key NPI product sample and mass production product main processes of CNC and tradition hot press or copper plating and image transfer and other small processes problem solving and using Minitab analysis raw data. If analysis result does not provide stable quality. He needs to provide action plan and tracking yield rate until meet expectation.

負責提升該製程依據收集各生產良率與生產製程能力數據, 並改善該製程生產良率與效率提升

Responsible for improving their own processes yield rate improvement and process capability maintain meet product requirement. He also needs to improve their own processes efficiency improvement.

3

協助樣品解決CNC 與壓合或電鍍與影像轉移製程問題並將手法與作業參數修改進入SOP使生產單位可以依據標準作業手法生產出符合預期目標的良率.

Proving CNC and lamination or copper plating and image transfer parameter suggestion Sample build. If found sample issue of parameter or new method to improve yield rate, need to modify into SOP for future mass production yield ate meet expectation.

4

負責成本節省專案開立, 達成公司與部門節省目標

Responsible for cost saving project creating and exclusion to meet PE department goal and CFPA goal of cost saving.

5

負責新設備和新技術製程能力提升評估與開發

Responsible for new machine and new capability develop or evaluation

6

收集生產與NPI 製樣問題, 將生產與製樣問題改善對策撰寫入PFMEA中, 已達成製程異常改善預防

NPI problems and action plan collection and summary into PFMEA

The Experience You Will Bring

Scope

Requirements:

• 汽車與醫療產品NPI產品從樣品導入之量產, 將樣品良率提升知可量產目標良率
• Automobile and medical NPI product yield rate improve from sample to mass production target.
  

Required

EDUCATION:

• 大學或碩士.
  

What Will Put You Ahead

Required

WORK EXPERIENCE:

• PCB or FPC R&D engineer or Process engineer 7 years above
  

Preferred

• Familiar with CNC and lamination or Copper plating and Image transfer experiences.
  

Required

SKILLS & ABILITIES:

• Minitab, PFMEA, APQP member (Windows, Word, Excel, PowerPoint, Outlook).
• Familiar Six Sigma tools and certificated on Green Belt or Black Belt